GL3227E   USB 3.2 Gen 1 to e•MMC HS400 RAID0 Bridge Controller

GL3227E是一款USB 3.1 Gen 1 eMMC RAID讀卡器，它提供單個(gè)LUN（邏輯單元號(hào)），可以支持;MMC v5.0、1/4/8bit數(shù)據(jù)總線、高速SDR/高速DDR/HS200/HS400模式。

GL3227E集成了高速8051微處理器和高效硬件引擎，可在USB和各種存儲(chǔ)卡接口之間實(shí)現(xiàn)的數(shù)據(jù)傳輸性能。它支持串行外圍接口（SPI），通過USB端口將固件升級(jí)到SPI閃存。它還集成了5V至3.3V和3.3V至1.8V/1.2V的穩(wěn)壓器和功率MOSFET，可以降低系統(tǒng)BOM成本。

• USB specification compliance

• Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.1 Gen 1)

• Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)

• Comply with USB Mass Storage Class Specification rev. 1.0

• Support USB Mass Storage Class Bulk-Only Transport (BOT)

• Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)

• Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates

• Integrated USB building blocks

• USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)

• Embedded high speed 8051 micro-controller

• High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces

• Support Embedded MultiMediaCard TM (e•MMC)

• e•MMC specification v4.3/ v4.4/ v4.5/ v5.0

• High Speed SDR/ High Speed DDR/ HS200/ HS400

• Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface

• Support firmware stored in eMMC and upgrade firmware via USB interface

• On-Chip 5V to 3.3V, 3.3V to 1.8V/1.2V regulator

• On-Chip power MOSFETs for flash media cards power source

• On-Chip 1.8V power source for VCCQ of e•MMC to operate as HS200/HS400 mode.

• On board 25 MHz Crystal driver circuit

• Support USB 2.0 LPM (Link Power Management)

• Support USB 3.1 Gen 1 LTM (Latency Tolerance Messaging)

• Support USB 3.1 Gen 1 U1/U2/U3 low power link state

• Pass the USB-IF Test Procedure for SuperSpeed product (TID: 341010008)

• Support two e•MMC chips by RAID 0 to increase the reading/writing performance

• Support one or two e•MMC chips by PCB co-layout, flexible for product design

• Support reset control of e•MMC for better compatibility

• Support PIA (Partition Information Area) in e•MMC to store customized VID/PID, USB device descriptor, SCSI inquiry and EEP configuration to save extra BOM cost

• Support programmable SSC (Spread Spectrum Clocking), clock rate in memory card interface for better EMI test effect

• Support Over-Current protection mechanism

• Support one power/access indicator LED (shared with SPI_MOSI)

• Available in QFN48 pin package (6x6mm)