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GL3227E

型號(hào)(PratNumber) GL3227E
數(shù)量(QTY.) 9000
廠家(Brand) GENESYS/創(chuàng)惟科技
封裝(Package) QFN48
批號(hào)(DC.) 23+
聯(lián)系人(contact) 顏先生/William
電話(contact) 0755-82170220,21001680
PDF(PDF.)
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1.產(chǎn)品簡(jiǎn)介


GL3227E   USB 3.2 Gen 1 to e•MMC HS400 RAID0 Bridge Controller




GL3227E是一款USB 3.1 Gen 1 eMMC RAID讀卡器,它提供單個(gè)LUN(邏輯單元號(hào)),可以支持;MMC v5.0、1/4/8bit數(shù)據(jù)總線、高速SDR/高速DDR/HS200/HS400模式。


GL3227E集成了高速8051微處理器和高效硬件引擎,可在USB和各種存儲(chǔ)卡接口之間實(shí)現(xiàn)的數(shù)據(jù)傳輸性能。它支持串行外圍接口(SPI),通過USB端口將固件升級(jí)到SPI閃存。它還集成了5V至3.3V和3.3V至1.8V/1.2V的穩(wěn)壓器和功率MOSFET,可以降低系統(tǒng)BOM成本。


  • USB specification compliance

    • Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.1 Gen 1)

    • Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)

    • Comply with USB Mass Storage Class Specification rev. 1.0

    • Support USB Mass Storage Class Bulk-Only Transport (BOT)

    • Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)

    • Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates

  • Integrated USB building blocks

    • USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)

  • Embedded high speed 8051 micro-controller

  • High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces

  • Support Embedded MultiMediaCard TM (e•MMC)

    • e•MMC specification v4.3/ v4.4/ v4.5/ v5.0

    • High Speed SDR/ High Speed DDR/ HS200/ HS400

  • Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface

  • Support firmware stored in eMMC and upgrade firmware via USB interface

  • On-Chip 5V to 3.3V, 3.3V to 1.8V/1.2V regulator

  • On-Chip power MOSFETs for flash media cards power source

  • On-Chip 1.8V power source for VCCQ of e•MMC to operate as HS200/HS400 mode.

  • On board 25 MHz Crystal driver circuit

  • Support USB 2.0 LPM (Link Power Management)

  • Support USB 3.1 Gen 1 LTM (Latency Tolerance Messaging)

  • Support USB 3.1 Gen 1 U1/U2/U3 low power link state

  • Pass the USB-IF Test Procedure for SuperSpeed product (TID: 341010008)

  • Support two e•MMC chips by RAID 0 to increase the reading/writing performance

  • Support one or two e•MMC chips by PCB co-layout, flexible for product design

  • Support reset control of e•MMC for better compatibility

  • Support PIA (Partition Information Area) in e•MMC to store customized VID/PID, USB device descriptor, SCSI inquiry and EEP configuration to save extra BOM cost

  • Support programmable SSC (Spread Spectrum Clocking), clock rate in memory card interface for better EMI test effect

  • Support Over-Current protection mechanism

  • Support one power/access indicator LED (shared with SPI_MOSI)

  • Available in QFN48 pin package (6x6mm)


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