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    GL3227E

    型號(PratNumber) GL3227E
    數量(QTY.) 9000
    廠家(Brand) GENESYS/創惟科技
    封裝(Package) QFN48
    批號(DC.) 23+
    聯系人(contact) 顏先生/William
    電話(contact) 0755-82170220,21001680
    PDF(PDF.)
    詢價(Inquire)
    1.產品簡介


    GL3227E   USB 3.2 Gen 1 to e&#8226;MMC HS400 RAID0 Bridge Controller




    GL3227E是一款USB 3.1 Gen 1 eMMC RAID讀卡器,它提供單個LUN(邏輯單元號),可以支持;MMC v5.0、1/4/8bit數據總線、高速SDR/高速DDR/HS200/HS400模式。


    GL3227E集成了高速8051微處理器和高效硬件引擎,可在USB和各種存儲卡接口之間實現的數據傳輸性能。它支持串行外圍接口(SPI),通過USB端口將固件升級到SPI閃存。它還集成了5V至3.3V和3.3V至1.8V/1.2V的穩壓器和功率MOSFET,可以降低系統BOM成本。


    • USB specification compliance

      • Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.1 Gen 1)

      • Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)

      • Comply with USB Mass Storage Class Specification rev. 1.0

      • Support USB Mass Storage Class Bulk-Only Transport (BOT)

      • Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)

      • Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates

    • Integrated USB building blocks

      • USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)

    • Embedded high speed 8051 micro-controller

    • High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces

    • Support Embedded MultiMediaCard TM (e&#8226;MMC)

      • e&#8226;MMC specification v4.3/ v4.4/ v4.5/ v5.0

      • High Speed SDR/ High Speed DDR/ HS200/ HS400

    • Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface

    • Support firmware stored in eMMC and upgrade firmware via USB interface

    • On-Chip 5V to 3.3V, 3.3V to 1.8V/1.2V regulator

    • On-Chip power MOSFETs for flash media cards power source

    • On-Chip 1.8V power source for VCCQ of e&#8226;MMC to operate as HS200/HS400 mode.

    • On board 25 MHz Crystal driver circuit

    • Support USB 2.0 LPM (Link Power Management)

    • Support USB 3.1 Gen 1 LTM (Latency Tolerance Messaging)

    • Support USB 3.1 Gen 1 U1/U2/U3 low power link state

    • Pass the USB-IF Test Procedure for SuperSpeed product (TID: 341010008)

    • Support two e&#8226;MMC chips by RAID 0 to increase the reading/writing performance

    • Support one or two e&#8226;MMC chips by PCB co-layout, flexible for product design

    • Support reset control of e&#8226;MMC for better compatibility

    • Support PIA (Partition Information Area) in e&#8226;MMC to store customized VID/PID, USB device descriptor, SCSI inquiry and EEP configuration to save extra BOM cost

    • Support programmable SSC (Spread Spectrum Clocking), clock rate in memory card interface for better EMI test effect

    • Support Over-Current protection mechanism

    • Support one power/access indicator LED (shared with SPI_MOSI)

    • Available in QFN48 pin package (6x6mm)


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